Semiconductor integrated circuit device and method of manufacturing same

ABSTRACT

In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad.

CROSS-REFERENCE TO RELATED APPLICATIONS

The disclosure of Japanese Patent Application No. 2009-99689 filed onApr. 16, 2009 including the specification, drawings and abstract isincorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor integrated circuitdevice (hereinafter referred to also as semiconductor device) and amethod of manufacturing same, specifically to a technology effective inapplying thereof to a technology relating to peripheral area of padelectrode such as that of aluminum-based bonding pad.

Japanese Patent Laid-Open No. 2006-303452 (Patent Document 1) orUSP-2006-0249845 (Patent Document 2) discloses a technology of coveringan aluminum-based bonding pad with a silicon nitride film or the likeover entire surface thereof including side faces of anti-reflection filmsuch as titanium nitride film at edge part of peripheral area of uppersurface thereof in order to prevent elution of the aluminum-based padcaused by cell reaction due to external moisture and the like at the padportion.

Japanese Patent Laid-Open No. 2007-103593 (Patent Document 3) disclosesa technology of covering an aluminum-based bonding pad with a siliconnitride film or the like over entire surface thereof including sidefaces of anti-reflection film such as titanium nitride film at edge partof peripheral area of upper surface thereof in order to prevent elutionof the aluminum-based pad caused by local cell effect due to moistureand the like at the pad portion.

SUMMARY OF THE INVENTION

In the current manufacturing process of LSI, or semiconductor integratedcircuit device, the step of assembling device (such as resin sealingstep) is normally followed by the voltage-application test(high-temperature and high-humidity test) in an environment of hightemperature (such as an approximate range from 85 to 130° C.) and highhumidity (such as about 80% RH). For that test, the inventors of thepresent invention found the phenomenon of occurrence of separation oftitanium nitride film as the anti-reflection film from upper film and ofgeneration of cracks in the titanium nitride film at an edge part ofupper surface of the aluminum-based bonding pad applied with a positivevoltage during the high-temperature and high-humidity test caused by anelectrochemical reaction due to moisture incoming through the sealingresin and the like to generate oxidation and bulging of the titaniumnitride film.

The present invention has been perfected to solve these problems.

The present invention has been made in view of the above circumstancesand provides a process for manufacturing a highly reliable semiconductorintegrated circuit device.

The other purposes and the new feature of the present invention willbecome clear from the description of the present specification and theaccompanying drawings.

The following explains briefly the outline of a typical invention amongthe inventions disclosed in the present application.

An invention of the present application is to remove the titaniumnitride film over the pad in a ring or slit shape at peripheral area ofthe aluminum-based bonding pad.

The following explains briefly the effect acquired by the typicalinvention among the inventions disclosed in the present application.

At peripheral area of the aluminum-based bonding pad, the titaniumnitride film over the pad is removed in a ring or slit shape, thuspreventing the propagation of influence of the oxidation of titanium tooutside the pad.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view illustrating a layout inside a chip ofsemiconductor integrated circuit device, (first main surface), ofEmbodiment 1, (same is applied to Embodiments 2 to 5);

FIG. 2 illustrates a front cross sectional view of a BGA package withthe chip in FIG. 1 sealed;

FIG. 3 illustrates an enlarged plan view of peripheral area of a bondingpad part corresponding to an enlarged part R in peripheral area of thepad, in the layout inside the chip (first main surface) of thesemiconductor integrated circuit device of Embodiment 1 of the presentapplication;

FIG. 4 illustrates an enlarged plan view of peripheral area of thebonding pad part, giving the state after wire bonding at a portioncorresponding to FIG. 3;

FIG. 5 illustrates a chip cross sectional view of X-X′ section in FIG.3;

FIG. 6 illustrates a chip cross sectional view of Y-Y′ section in FIG.3;

FIG. 7 illustrates a device cross sectional flow diagram (step offorming an auxiliary insulation film) corresponding to X-X′ section inFIG. 3 in a method of manufacturing a semiconductor integrated circuitdevice of Embodiment 1 of the present application;

FIG. 8 illustrates a device cross sectional flow diagram (step offorming a resist film for patterning a titanium nitride film removingpart) corresponding to X-X′ section in FIG. 3 in the method ofmanufacturing a semiconductor integrated circuit device of Embodiment 1of the present application;

FIG. 9 illustrates a device cross sectional flow diagram (step offorming a titanium nitride film removing part) corresponding to X-X′section in FIG. 3 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 1 of the present application;

FIG. 10 illustrates a device cross sectional flow diagram (step offorming an insulation surface protective film) corresponding to X-X′section in FIG. 3 in the method of manufacturing semiconductorintegrated circuit device of Embodiment 1 of the present application;

FIG. 11 illustrates a device cross sectional flow diagram (step offorming a pad opening) corresponding to X-X′ section in FIG. 3 in themethod of manufacturing a semiconductor integrated circuit device ofEmbodiment 1 of the present application;

FIG. 12 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of asemiconductor integrated circuit device of Embodiment 2 of the presentapplication;

FIG. 13 illustrates a chip cross sectional view of X-X′ section in FIG.12;

FIG. 14 illustrates a chip cross sectional view of A-A′ section in FIG.12;

FIG. 15 illustrates a chip cross sectional view of Y-Y′ section in FIG.12;

FIG. 16 illustrates an enlarged plan view at peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of asemiconductor integrated circuit device of Embodiment 3 of the presentapplication;

FIG. 17 illustrates a chip cross sectional view of Y-Y′ section in FIG.16;

FIG. 18 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of asemiconductor integrated circuit device of Embodiment 4 of the presentapplication;

FIG. 19 illustrates a chip cross sectional view of X-X′ section in FIG.18;

FIG. 20 illustrates a chip cross sectional view of Y-Y′ section in FIG.18;

FIG. 21 illustrates a device cross sectional flow diagram (step offorming an insulation surface protective film) corresponding to X-X′section in FIG. 18 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 4 of the present application;

FIG. 22 illustrates a device cross sectional flow diagram (step offorming a resist film for patterning a titanium nitride film removingpart and a pad opening) corresponding to X-X′ section in FIG. 18 in themethod of manufacturing a semiconductor integrated circuit device ofEmbodiment 4 of the present application;

FIG. 23 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of asemiconductor integrated circuit device of Embodiment 5 of the presentapplication;

FIG. 24 illustrates a chip cross sectional view of X-X′ in FIG. 23;

FIG. 25 illustrates a chip cross sectional view of Y-Y′ section in FIG.23;

FIG. 26 illustrates a device cross sectional flow diagram (step offorming an auxiliary insulation film) corresponding to X-X′ section inFIG. 23 in the method of manufacturing a semiconductor integratedcircuit device of Embodiment 5 of the present application;

FIG. 27 illustrates a device cross sectional flow diagram (step offorming a resist film for patterning a titanium nitride film removingpart) corresponding to X-X′ section in FIG. 23 in the method ofmanufacturing the semiconductor integrated circuit device of Embodiment5 of the present application;

FIG. 28 illustrates a device cross sectional flow diagram (step offorming a titanium nitride film removing part) corresponding to X-X′section in FIG. 23 in the method of manufacturing the semiconductorintegrated circuit device of Embodiment 5 of the present application;

FIG. 29 illustrates a device cross sectional flow diagram (step offorming an insulation surface protective film) corresponding to X-X′section in FIG. 23 in the method of manufacturing the semiconductorintegrated circuit device of Embodiment 5 of the present application;and

FIG. 30 illustrates a device cross sectional flow diagram (step offorming a pad opening) corresponding to X-X′ section in FIG. 23 in themethod of manufacturing the semiconductor integrated circuit device ofEmbodiment 5 of the present application.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS Outline of the Embodiments

Outline of the typical inventions disclosed in the present applicationwill be described below.

1. A semiconductor integrated circuit device comprising:

(a) a semiconductor chip having a first and a second main surface; (b)an aluminum-based metal film pattern provided over the first mainsurface of the semiconductor chip; (c) a titanium nitride film coveringan upper surface of the aluminum-based metal film pattern; (d) aninsulation surface protective film covering the first main surface ofthe semiconductor chip including an upper surface of the titaniumnitride film; (e) a bonding pad opening formed in the insulation surfaceprotective film; (f) a first opening part corresponding to the bondingpad opening formed in the titanium nitride film; and (g) a secondopening part formed in the titanium nitride film in the vicinity of thefirst opening part.

2. The semiconductor integrated circuit device according to above 1,wherein the second opening part of the aluminum-based metal film patternis covered with the insulation surface protective film.

3. The semiconductor integrated circuit device according to above 2,wherein the insulation surface protective film is a laminated filmcontaining a silicon oxide-based film as a lower layer and a siliconnitride-based film as an upper layer.

4. The semiconductor integrated circuit device according to above 1 or3, wherein the titanium nitride film is covered with the insulationsurface protective film, and the second opening part is not covered withthe insulation surface protective film.

5. The semiconductor integrated circuit device according to any one ofabove 1 to 4, wherein a passivation film is formed over the surface ofthe aluminum-based metal film pattern of the second opening part.

6. The semiconductor integrated circuit device according to any one ofabove 1 to 5, wherein the width of the second opening part is in a rangefrom 0.3 to 10 micrometer.

7. The semiconductor integrated circuit device according to any one ofabove 1 to 6, wherein the width of the first opening part is larger thanthat of the second opening part.

8. The semiconductor integrated circuit device according to any one ofabove 1 to 7, wherein the second opening part is formed in a ring shapeso as to surround the first opening part.

9. The semiconductor integrated circuit device according to any one ofabove 1 to 8, wherein the first opening part has a wire bonding regionand a wafer test probe contact region.

10. The semiconductor integrated circuit device according to any one ofabove 1 to 9, wherein, in a needle-trace portion in the wafer test probecontact region, a passivation film on the surface of the aluminum-basedmetal film pattern is removed.

11. The semiconductor integrated circuit device according to any one ofabove 1 to 9, wherein the aluminum-based metal film pattern has abonding pad part containing the first opening part therein and a wiringpart coupled thereto, and the second opening part is formed in thevicinity of a boundary between the bonding pad part and the wiring part.

12. The semiconductor integrated circuit device according to any one ofabove 1 to 11, further comprising: (h) the first main surface of thesemiconductor chip, the aluminum-based metal film pattern, the titaniumnitride film, the first opening part, and the second opening part, allof which being sealed with a halogen-free resin.

Furthermore, outline of other inventions disclosed in the presentapplication will be described below.

13. A method of manufacturing a semiconductor integrated circuit devicecomprising the steps of: (a) forming a metal composite film pattern bypatterning a metal composite film containing a lower layer barrier metalfilm, a middle layer aluminum-based metal film, and an upper layerbarrier metal film, which are formed over a multilayer wiring layer overa device surface of a semiconductor wafer; (b) forming an insulationsurface protective film over almost entire surface of the device surfaceof the semiconductor wafer including the upper surface of the metalcomposite film pattern; (c) after the step (b) and before the step (d),forming a bonding pad opening in the insulation surface protective film;(d) forming a first opening part at a portion corresponding to thebonding pad opening of the upper layer barrier metal film; and (e)forming a second opening part in the upper layer barrier metal film inthe vicinity of the first opening part.

14. The method of manufacturing a semiconductor integrated circuitdevice according to above 13, wherein the step (e) is executed beforethe steps (b) and (d).

15. The method of manufacturing semiconductor integrated circuit deviceaccording to above 13, wherein the steps (d) and (e) are executed atnearly the same time after the steps (b) and (c).

16. The method of manufacturing a semiconductor integrated circuitdevice according to above 13, wherein the insulation surface protectivefilm is a laminated film containing a silicon oxide-based film as alower layer and a silicon nitride-based film as an upper layer.

17. The method of manufacturing a semiconductor integrated circuitdevice according to above 15, wherein the steps (d) and (e) are executedby continuous processing of the insulation surface protective film andthe upper layer barrier metal film using the same etching mask.

18. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 13 to 17, wherein the width of thesecond opening part is in a range from 0.3 to 10 micrometer.

19. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 13 to 18, wherein the width of thefirst opening part is larger than that of the second opening part.

20. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 13 to 19, wherein the secondopening part is formed in a ring shape so as to surround the firstopening part.

21. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 13 to 20, wherein the metalcomposite film pattern has a bonding pad part containing the firstopening part therein and a wiring part coupled thereto, and the secondopening part is formed in the vicinity of a boundary between the bondingpad part and the wiring part.

22. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 13 to 21, further comprising thestep of (f) after the steps (a), (d) and (e), applying a passivationtreatment to an exposed surface portion of the middle layeraluminum-based metal film.

23. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 13 to 22, further comprising thestep of (g) after the steps (a) to (e), executing wafer probe inspectionby letting a probe needle contact with the surface of the middle layeraluminum-based metal film at the first opening part, and breaking apassivation film over the surface thereof to establish contact.

24. The method of manufacturing a semiconductor integrated circuitdevice according to above 23, further comprising the step of (h) afterthe step (g), sealing the upper surface of the metal composite film witha halogen-free resin.

Furthermore, outline of other inventions disclosed in the presentapplication will be described below.

25. A semiconductor integrated circuit device comprising: (a) asemiconductor chip having a first and a second main surface; (b) aplurality of aluminum-based bonding pads provided over the first mainsurface of the semiconductor chip; (c) an insulation surface protectivefilm covering the first main surface and a peripheral area of each ofthe bonding pads; and (d) a first opening in the insulation surfaceprotective film formed over each of the bonding pads, wherein each ofthe bonding pads has no titanium nitride film thereon.

26. The semiconductor integrated circuit device according to above 25,wherein the bonding pads are arranged in a row in a first directionalong an edge part of the chip.

27. The semiconductor integrated circuit device according to above 25 or26, wherein each of the bonding pads is integrally coupled to analuminum-based wiring in the same layer, and a titanium nitride film isformed over the wiring.

28. The semiconductor integrated circuit device according to any one ofabove 25 to 27, wherein the insulation surface protective film covers anupper surface and side faces of the titanium nitride film.

29. The semiconductor integrated circuit device according to any one ofabove 25 to 28, wherein each of the bonding pads has a nearlyrectangular shape, and has a bonding region to which the bonding wire iscoupled and a contact region to which a probe needle contacts.

30. The semiconductor integrated circuit device according to any one ofabove 25 to 29, wherein an exposed part of each bonding pad is coveredwith an aluminum oxide-based passivation film except for a part of thecontact region.

31. The semiconductor integrated circuit device according to any one ofabove 25 to 30, further comprising (e) a halogen-free sealing resinmember covering the first main surface of the semiconductor chip, thebonding pads, and the insulation surface protective film.

32. The semiconductor integrated circuit device according to any one ofabove 26 to 31, wherein the titanium nitride film is absent in thevicinity of each bonding pad of the wiring and is present in the otherportions, in a second direction orthogonal to the first direction.Furthermore, outline of other inventions disclosed in the presentapplication will be described below.

33. A method of manufacturing a semiconductor integrated circuit devicecomprising the steps of: (a) forming an aluminum-based metal film over afirst insulation film over a first main surface of a semiconductorwafer; (b) forming a titanium nitride film over the aluminum-based metalfilm; (c) forming a composite film pattern which becomes a plurality ofbonding pads by patterning a composite film containing thealuminum-based metal film and the titanium nitride film; (d) exposing anupper surface of each of the bonding pads by removing the titaniumnitride film from the composite film pattern; (e) forming an insulationsurface protective film over the first main surface of the semiconductorchip and over each of the bonding pads; and (f) forming a first openingin the insulation surface protective film over each of the bonding pads.

34. The method of manufacturing a semiconductor integrated circuitdevice according to above 33, wherein the bonding pads are arranged in arow in a first direction along an edge part of the chip.

35. The method of manufacturing a semiconductor integrated circuitdevice according to above 33 or 34, wherein the composite film patterncontains an aluminum-based wiring in the same layer as that of eachbonding pad.

36. The method of manufacturing a semiconductor integrated circuitdevice according to above 35, wherein the insulation surface protectivefilm covers an upper surface and side faces of the titanium nitridefilm.

37. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 33 to 36, wherein each bonding padhas a nearly rectangular shape, and has a bonding region to which thebonding wire is coupled and a contact region to which a probe needlecontacts.

38. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 33 to 37, wherein an exposed partof each bonding pad is covered with an aluminum oxide-based passivationfilm except for a part of the contact region.

39. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 33 to 38, further comprising thestep of (g) after the step (f), sealing the first main surface of thesemiconductor chip, the bonding pads, and the insulation surfaceprotective film by covering thereon with a halogen-free resin member.

40. The method of manufacturing a semiconductor integrated circuitdevice according to any one of above 33 to 39, wherein, after the step(d), the titanium nitride film is absent in the vicinity of each bondingpad of the wiring and is present in the other portions, in a seconddirection orthogonal to the first direction.

Furthermore, outline of other inventions disclosed in the presentapplication will be described below.

1. A semiconductor integrated circuit device comprising: (a) asemiconductor chip having a first and a second main surface; (b) amultilayer wiring layer formed over the first main surface of thesemiconductor chip: (c) an I/O circuit region formed over the first mainsurface of the semiconductor chip; (d) an aluminum-based metal filmpattern provided over the multilayer wiring layer and having a bondingpad part and a wiring part coupling the bonding pad part and the I/Ocircuit region with each other; (e) a titanium nitride film covering anupper surface of the aluminum-based metal film pattern; (f) aninsulation surface protective film covering upper surfaces of themultilayer wiring layer, the aluminum-based metal film pattern, and thetitanium nitride film; (g) a bonding pad opening formed by penetratingthrough the titanium nitride film and the insulation surface protectivefilm so as to correspond to the inside of the bonding pad part; and (h)a titanium nitride film removing part provided over the aluminum-basedmetal film pattern at a part of area except for the bonding pad opening,wherein the bonding pad opening and the titanium nitride film removingpart are not coupled to each other.

2. The semiconductor integrated circuit device according to above 1,wherein the titanium nitride film removing part has a first titaniumnitride film removing part provided in a ring shape so as to surroundthe bonding pad opening inside the bonding pad part.

3. The semiconductor integrated circuit device according to above 1,wherein the titanium nitride film removing part has a second titaniumnitride film removing part provided in the vicinity of the boundarybetween the bonding pad part and the circuit part.

4. The semiconductor integrated circuit device according to above 1,wherein the titanium nitride film removing part has a first titaniumnitride film removing part provided in a ring shape so as to surroundthe bonding pad opening in the bonding pad part, and has a secondtitanium nitride film removing part provided in the vicinity of theboundary between the bonding pad part and the circuit part.

5. The semiconductor integrated circuit device according to any one ofabove 1 to 4, wherein the titanium nitride film removing part is coveredwith the insulation surface protective film.

6. The semiconductor integrated circuit device according to any one ofabove 1 to 4, wherein the titanium nitride film removing part is notcovered with the insulation surface protective film.

7. The semiconductor integrated circuit device according to any one ofabove 1 to 6, wherein the insulation surface protective film is alaminated film containing a silicon oxide-based film as a lower layerand a silicon nitride-based film as an upper layer.

8. The semiconductor integrated circuit device according to any one ofabove 2 and 4 to 7, wherein the width of the first titanium nitride filmremoving part is in a range from 0.3 to 2 micrometer.

9. The semiconductor integrated circuit device according to any one ofabove 3 to 8, wherein the width of the second titanium nitride filmremoving part is in a range from 0.3 to 10 micrometer.

10. The semiconductor integrated circuit device according to any one ofabove 1 to 9, wherein the width of the bonding pad part is larger thanthat of the titanium nitride film removing part.

11. The semiconductor integrated circuit device according to any one ofabove 1 to 10, wherein the bonding pad opening has a rectangular shape.

12. The semiconductor integrated circuit device according to above 11,wherein the bonding pad opening has a wire bonding region and a wafertest probe contact region.

13. The semiconductor integrated circuit device according to above 12,further comprising (i) a probe mark formed in the upper surface of thealuminum-based metal film pattern in the wafer test probe contactregion.

14. The semiconductor integrated circuit device according to above 12 or13, further comprising (j) a bonding wire coupled to the wire bondingregion.

15. The semiconductor integrated circuit device according to any one ofabove 1 to 14, further comprising (k) a sealing resin member coveringthe first main surface side of the semiconductor chip.

16. The semiconductor integrated circuit device according to above 15,wherein the sealing resin member is substantially halogen-free.

17. The semiconductor integrated circuit device according to above 13,wherein an exposed part of the aluminum-based metal film pattern iscovered with a passivation film except for the portion of the probemark.

18. A semiconductor integrated circuit device comprising: (a) asemiconductor chip having a first and a second main surface; (b) amultilayer wiring layer formed over the first main surface of thesemiconductor chip; (c) an I/O circuit region formed over the first mainsurface of the semiconductor chip; (d) a plurality of aluminum-basedmetal film patterns provided over the multilayer wiring layer and havinga bonding pad part and a wiring part coupling the bonding pad part andthe I/O circuit region with each other; (e) a titanium nitride filmcovering an upper surface of each of the aluminum-based metal filmpatterns; (f) an insulation surface protective film formed so as tocover upper surfaces of the multilayer wiring layer, the aluminum-basedmetal film pattern, and the titanium nitride film; (g) a bonding padopening formed by penetrating through the titanium nitride film and theinsulation surface protective film so as to correspond to the inside ofthe bonding pad part; and (h) a titanium nitride film removing partprovided over a part of the aluminum-based metal film pattern so as tocontain entire area of the bonding pad part except for the bonding padopening, wherein the bonding pad opening and the titanium nitride filmremoving part are coupled to each other over the entire peripherythereof.

19. The semiconductor integrated circuit device according to above 18,wherein the bonding pad parts are arranged in a row in a first directionalong the edge part of the chip.

20. The semiconductor integrated circuit device according to above 18 or19, wherein the upper surface of each aluminum-based metal film patternat least at near the I/O circuit region of the wiring part is coveredwith the titanium nitride film.

21. The semiconductor integrated circuit device according to any one ofabove 18 to 20, wherein the titanium nitride film removing part iscovered with the insulation surface protective film.

22. The semiconductor integrated circuit device according to any one ofabove 18 to 21, wherein the insulation surface protective film is alaminated film containing a silicon oxide-based film as a lower layerand a silicon nitride-based film as an upper layer.

23. The semiconductor integrated circuit device according to any one ofabove 18 to 22, wherein the bonding pad opening has a rectangular shape.

24. The semiconductor integrated circuit device according to above 23,wherein the bonding pad opening has a wire bonding region and a wafertest probe contact region.

25. The semiconductor integrated circuit device according to above 24,further comprising (i) a probe mark formed in the upper surface of eachaluminum-based metal film pattern in the wafer test probe contactregion.

26. The semiconductor integrated circuit device according to above 24 or25, further comprising (j) a bonding wire coupled to the wire bondingregion.

27. The semiconductor integrated circuit device according to any one ofabove 18 to 26, further comprising (k) a sealing resin member coveringthe first main surface side of the semiconductor chip.

28. The semiconductor integrated circuit device according to above 27,wherein the sealing resin member is substantially halogen-free.

29. The semiconductor integrated circuit device according to above 25,wherein the exposed part of the aluminum-based metal film pattern iscovered with a passivation film except for the portion of the probemark.

Explanation of the Description Type, Basic Terminology and Use Thereofin the Present Application

1. While the description of the embodiment is sometimes divided asneeded into a plurality of sections for convenience in the presentapplication, these divided descriptions are not independent or differentfrom one another, but they are respective parts of one example, one ofthem is partial details of another one, or they are modifications or thelike of a part of or a whole of the embodiment, except when it isexplicitly indicated in particular that this is not the case. Further,in principle, repeated explanation is omitted for the same part. Inaddition, each constituent of the embodiment is not essential exceptwhen it is explicitly indicated in particular that this is not the case,except when the number of the constituents is determined theoretically,and except when it is clear from a context that this is not the case.

Further, in the present application, the “semiconductor integratedcircuit device” means a device mainly integrating various transistors(active elements) in particular together with a resistor, a capacitor,and the like (e.g., a single crystal silicon substrate) over asemiconductor chip or the like. Typical products of the above-described“various transistors” include MISFET (Metal Insulator SemiconductorField Effect Transistor) represented by MOSFET (Metal OxideSemiconductor Field Effect Transistor). Typical integrated circuitstructure includes CMIS (Complementary Metal Insulator Semiconductor)type integrated circuit represented by CMOS (Complementary Metal OxideSemiconductor) type integrated circuit combining N-channel type MISFETwith P-channel type MIFET.

The current semiconductor integrated circuit device, or the waferprocess of LSI (Large Scale Integration), is generally divided into twostages: the first is FEOL (Front End of Line) stage beginning from thestep of carry-in of silicon wafer as the raw material to around thepremetal step comprising the formation of interlayer insulation filmbetween the lower end of M1 wiring layer and the gate electrodestructure, the formation of contact hole, the tungsten plug, theburying, and the like; and the second is BEOL (Back End of Line) stagebeginning from the step of forming the M1 wiring layer to around thestep of forming the pad opening in the final passivation film over thealuminum-based pad electrode, (wafer level package process includes theprocess). As for the FEOL stage, the step of gate electrode pattering,the step of contact hole forming, and the like are fine-processing stepsrequiring specially fine processing. On the other hand, the BEOL stagerequires specially fine processing in the step of via and trenchforming, specifically in the local wiring at relatively low layers (forexample, copper-based damascene type buried wiring of about six layersrequires fine burying wiring from M1 to around M4) or the like. The term“MN (normally N=about 1 to about 15)” signifies the wiring at Nth layer(counted from bottom). That is, “M1” signifies the wiring in the firstlayer, and M3 signifies the wiring in the third layer. According to theexample given here, there are six layers of metal wiring under thealuminum-based pad electrode layer and the tungsten via layer directlybeneath the aluminum-based pad electrode layer.

2. Similarly in the description of the embodiments, even when amaterial, a composition, or the like is described as “X composed of A”or the like, a material, a composition, or the like including an elementexcept A as a constituent is not excluded except when it is explicitlyindicated in particular that this is not the case, and except when it isclear from a context that this is not the case. For example, the aboveexpression means “X including A as a main component” for thecomposition. In detail, similar translation is applied to copper wiring,gold wiring, titanium nitride, aluminum layer, polyimide layer, and thelike.

Obviously, “silicon material” or the like, for example, is not limitedto pure silicon, but includes also a SiGe alloy and a multi-componentalloy containing silicon as a main component, and further includes alsoa silicon material containing another additive or the like. Similarly,the terms “silicon oxide film” and “silicon oxide-based insulation film”naturally include: relatively pure undoped silicon dioxide; FSG(fluorosilicate glass); TEOS-based silicon oxide; SiOC (siliconoxycarbide); carbon-doped silicon oxide; thermally oxidized film such asOSG (organosilicate glass), PSG (phosphorus silicate glass), BPSG(borophosphosilicate glass), PSG (phosphorus silicate glass), and BPSG(borophosphosilicate glass); CVD oxide film; coating type silicon oxidesuch as SOG (spin ON glass) and NSC (nano-clustering silica);silica-based Low-k insulation film (porous insulation film) introducingvoid to a member similar to above; and composite film with othersilicon-based insulation film having above material as the mainstructural element.

Along with the silicon oxide-based insulation film, siliconnitride-based insulation film is commonly used in the semiconductorfield as the silicon-based insulation film. Materials for the siliconnitride-based film include SiN, SiCN, SiNH, and SiCNH. The term “siliconnitride” referred to herein includes both SiN and SiNH unless explicitlyindicated otherwise. Similarly, the term “SiCN” includes both SiCN andSiCNH unless explicitly indicated otherwise.

Although SiC has similar properties with those of SiN, SiON is oftenclassified to the silicon oxide-based insulation film.

The silicon nitride film is widely used as the etch-stopping film in theSAC (Self-Aligned Contact) technology, and is also used as thestress-imparting film in SMT (Stress Memorization Technique).

3. Similarly for shape, a position, an attribute, or the like, whilethey are illustrated with respective preferable examples, obviously eachof them is not limited strictly to the preferable example except when itis explicitly indicated in particular that this is not the case andexcept when it is clear from a context that this is not the case.

4. Further, when a specific numerical value or amount is mentioned, thenumerical value or amount may be a numerical value exceeding thespecific numerical value or a numerical value smaller than the specificnumerical value except when it is explicitly indicated in particularthat this is not the case, except when the numerical value is limited tothe specific numerical value theoretically, and except when it is clearfrom a context that this is not the case.

5. While usually a “wafer” indicates a single crystal silicon wafer onwhich the semiconductor integrated circuit device (also, semiconductordevice and electronic device) is formed, a “wafer” obviously includes anepitaxial wafer, an SOI substrate, an insulating substrate such as anLCD glass substrate, a composite wafer of semiconductor layers, and thelike. The same is applied also to the wafer used in the followingembodiments.

Detail Description of the Embodiments

Details of the embodiments will be described further. In each of thedrawings, the same or a similar part is indicated by the same or asimilar symbol or reference number and explanation will not be repeatedin principle.

Further, in the accompanying drawings, hatching or the like is omittedeven from a cross section when the drawing is made complicated on thecontrary or when the cross section is clearly divided from a vacantspace. In a related matter, an outline in the back is sometimes omittedeven from a hole closed in a planar view when this is clear inexplanation or the like. Moreover, hatching is provided even for a partwhich is not a cross section in order to show the part is not a vacantspace.

1. Description of the semiconductor integrated circuit device and themethod of manufacturing the same of Embodiment 1 of the presentapplication (mainly from FIG. 1 to FIG. 11)

The description is given referring to an example of 90 nmtechnology-node highly-reliable CMIS LIS device. The description beginsfrom the outline of the layout of LSI device to which the pad-peripheralstructure as the core part of the device structure of the presentapplication is applied, and the structure of package to which the LSIdevice is incorporated, in the sub-section (1-1).

The characteristic of the structure peripheral to the pad according toEmbodiment 1 is to form a space around the bonding pad opening of eachbonding pad part beneath the final passivation film, thus forming aring-shape region where the upper layer barrier metal layer is removed.The ring-shape region is located at all around the bonding pad openingto eliminate all the origins of the titanium oxidation because theorigin of titanium oxidation exists at boundary of the bonding padopening. That is, even when the abnormal oxidation of titanium occurs atany point on the outer periphery of the bonding pad opening, short totallength of the periphery brings the stress small and prevents the crackgeneration in the inorganic passivation film and the like (includingauxiliary insulation film).

As described in Section 2, since the portion specifically sensitive tothe abnormal oxidation of titanium is at the wiring part of the bondingpad, the ring-shape titanium nitride film removing part is notnecessarily formed in a shape of closing over the entire periphery. Forexample, the titanium nitride film removing part may be given in alinear pattern only at a region 32 in the vicinity of boundary (FIG. 3and other drawings), or the portion centering on the region 32. When,however, even for an abnormal oxidation of titanium generated at aportion different from the wiring side of the bonding pad, once theresulting cracks occurred in the inorganic insulation film, moisture maycondense in the cracks to become a new source of abnormal oxidation. Forimproving further the reliability therefore, it is preferable to formthe pattern in totally closed shape.

The description gives an integral ring-shape (closed shape) as thering-shape titanium nitride film removing part. The shape may beseparated rings (such as a group of dots arranged in ring shape).Nevertheless, integral shape provides larger capacity to cut off thepropagation route of abnormal oxidation of titanium developing to cracksof inorganic passivation film and the like.

There may be an applicable method of covering the side face of outerperiphery of the bonding pad opening from outside to inside thereof by amoisture-resistant inorganic insulation film. The method, however, hasproblems such as increasing in the number of etching cycles and ofroughening of upper surface of the aluminum-based metal.

1-1. Example of layout inside the chip of the semiconductor integratedcircuit device common to Embodiments 1 to 5 of the present application(mainly FIG. 1 and FIG. 2)

FIG. 1 is a schematic plan view illustrating a layout inside the chip ofthe semiconductor integrated circuit device, (first main surface), ofEmbodiment 1 of the present application, (same is applied to Embodiments2 to 5). FIG. 2 illustrates a front cross sectional view of the BGApackage with the chip in FIG. 1 sealed.

The description begins with the outline of layout in the chip of thesemiconductor integrated circuit device of Embodiment 1 of the presentapplication, (same is applied to Embodiments 2 to 5). As illustrated inFIG. 1, a core circuit region 9 is provided at a center part of a firstmain surface 2 a (opposite side to the rear face or a second mainsurface 2 b) of, for example, a silicon-based semiconductor chip 2. AnI/O circuit region 6 is provided surrounding the core circuit region 9,which I/O circuit region 6 contains a ring-shape power source Vdd trunkwiring 8 (composed of, for example, an aluminum pad layer), a ring-shapepower source Vss trunk wiring 7 (composed of, for example, an aluminumpad layer), and a number of I/O circuits. At other area from the I/Ocircuit region 6 in the peripheral area of the chip 2, there arearranged a series of bonding pad rows 5 structured by the bonding pads 4(bonding pad parts) along each side of the chip 2. The bonding pad 4 isstructured by an aluminum pad layer. At the peripheral edge part of thechip 2 outside the bonding pad rows 5, a guard ring 3 is provided so asto surround the peripheral area of the chip 2. The metal layer as theuppermost layer of the guard ring 3 is made of, for example, aluminumpad layer. The enlarged part R in peripheral area of the pad isdescribed in FIG. 3 and the like. The bonding pad 4 given here as anexample has a nearly rectangular shape (corner part may have a roundpart, and peripheral area may have a deformed part as mark and thelike). The bonding pad 4 may have a square shape or may have a shapecontaining sloping line or curve. The description adopts an example ofplacing the I/O circuit region 6 between the core circuit region 9 andthe region arranging the bonding pad rows 5. However, the I/O circuitregion 6 may be placed in a region between the core circuit region 9 andthe guard ring 3. In that case, effective use of the space can beimproved because the I/O circuit can also be placed beneath the bondingpad row 5. On the other hand, for the example of locating the I/Ocircuit region 6 between the core circuit region 9 and the region ofplacing the bonding pad row 5, reliability can be improved because adistance is secured between the bonding pad 4 and the I/O circuit region6.

FIG. 2 illustrates across sectional view of a BGA package 11 as anexample of ultimate use mode of the chip. The ultimate use mode may be,other than the BGA package, WLP (Wafer Level Package) or other packagetype. As illustrated in FIG. 2, a wiring substrate 12 (interposer,single layer or multilayer wiring substrate) has, for example, aglass-epoxy-based organic wiring substrate core material 14 with athrough hole (via) 17. At upper surface 12 a and lower face 12 b of theorganic wiring substrate core material 14, there are attached a bumpland 15, a substrate wiring 19, an external lead 21, and the like. Asolder resist film 18 is overlaid thereon at need. A solder bump 16 forcoupling the package is formed over the bump land 15. Onto the uppersurface 12 a of the wiring substrate 12, the semiconductor chip 2 isdie-bonded via an adhesive layer 22 such as DAF (Die Attach Film). Eachbonding pad 4 on the surface 2 a of the semiconductor chip 2 is coupledto the external lead 21 by, for example, a gold bonding wire 23containing gold as the main component. The upper surface 12 a of thewiring substrate 12 is sealed with a sealing resin 24 containing, forexample, epoxy-based resin as the main resin component so as to seal theupper surface 2 a of the chip 2 and the wire 23 inside the assembly.

The individual sealing resin used herein is preferably a “halogen-freeresin” containing no halogen substance (specifically bromine) in thefire retardant in view of environmental concern and the like. From thepoint of reliability of sealing, however, the halogen-free resin likelycontains other halogen elements such as chlorine in larger quantity thanthat in ordinary resins. That is, based on the WEEE (Waste Electricaland Electronic Equipment) Command, there have been increased the requestof halogen-free for the package material for semiconductor chip: (1.chlorine (Cl) content of resin: 0.09% by weight or less, 2. bromine (Br)content of resin: 0.09% by weight or less, and 3. antimony (Sb) contentof resin: 0.09% by weight or less). However, the changes of packagematerials raised problems which were not obvious. That is, thevoltage-application test in high-temperature and high-humidityenvironment after the product assembly revealed that there likelyoccurred that the titanium nitride film over aluminum was oxidized atthe side wall of pad part subjected to positive voltage, thus generatedthe separation of titanium nitride film from upper film, and that theoxidation of titanium nitride film induced cracks by the volumeexpansion, thus resulted in the chip destruction failure.

1-2. Description of the structure peripheral to the pad of thesemiconductor integrated circuit device and the method of manufacturingthereof in Embodiment 1 of the present application (mainly FIG. 3 toFIG. 11)

FIG. 3 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of thesemiconductor integrated circuit device of Embodiment 1 of the presentapplication. FIG. 4 illustrates an enlarged plan view of peripheral areaof the bonding pad part, giving the state after wire bonding at aportion corresponding to FIG. 3. FIG. 5 illustrates a chip crosssectional view of X-X′ section in FIG. 3. FIG. 6 illustrates a chipcross sectional view of Y-Y′ section in FIG. 3.

In the layout inside the chip, (first main surface), of thesemiconductor integrated circuit device of Embodiment 1 of the presentapplication, the description is given on the structure in planeperipheral to the bonding pad part corresponding to the enlarged part Rin peripheral area of the pad. As illustrated in FIG. 3 (at the point ofcompletion of forming the bonding pad opening for the inorganic finalpassivation) and in FIG. 4 (at the point of completion of wire bonding),an aluminum-based metal film pattern 25 (corresponding to the aluminumpad layer) is divided into the bonding pad part 4 and a wiring part 26which couples the bonding pad part 4 and the I/O circuit region 6. Thearea in the vicinity of a boundary 31 between the bonding pad part 4 andthe I/O circuit region 26 is defined as a region 32 in the vicinity ofboundary. The center part of the bonding pad part 4 is a bonding padopening 27 (a first opening part 28 of the titanium nitride film inFIGS. 5 and 6). At peripheral area of the bonding pad part 4 around thebonding pad opening 27, there is provided a first titanium nitride filmremoving part 29 a, in a ring shape, (ring-shape titanium nitride filmremoving part or a second opening part 29) with a space from the bondingpad opening 27. The width T1 of the bonding pad part is, for example,about 50 micrometer (length of major side is, for example, about 80micrometer), and the width T2 of the ring-shape titanium nitride filmremoving part is, for example, about 0.9 micrometer (for example, about0.3 to about 2 micrometer is a preferable range). The width of the spaceinside the ring-shape titanium nitride film removing part 29 a is, forexample, about 0.9 micrometer (example of preferred range isapproximately from 0.3 to 2 micrometer), and the width of the externalspace is, for example, about 0.7 micrometer (example of preferred rangeis approximately from 0.3 to 2 micrometer).

As illustrated in FIG. 4, at the point of completion of wire bonding, awafer test probe contact region 34 in the bonding pad opening 27 (FIG.3) has probe marks 36, and a wire bonding region 33 has a bonding wirejunction 35 formed. Although dividing the region as above is notessentially required, dividing the region can improve the wire bondingcharacteristics.

As in this Embodiment, when the bonding pad part 4 has the wire bondingregion 33 and the wafer test probe contact region 34, the probe marks 36formed in the wafer test probe contact region 34 scrapes off the aluminafilm on the surface of an aluminum-based metal film 53 by thepassivation treatment described later. Then, the wafer test probecontact region 34 exposes in a state that the aluminum-based metal film53 is scraped out, which increases the possibility of generation ofelectrochemical reaction in the aluminum-based metal film 53 caused bymoisture entering from outside. Furthermore, a barrier metal film 54near the wafer test probe contact region 34 is likely affected to becomethe propagation route of abnormal oxidation of titanium. Since the wafertest probe contact region 34 is closer to the I/O circuit region 6rather than to the wire bonding region 33, the measures as described inthis Embodiment is further effective. The structure of providing thewire bonding region 33 and the wafer test probe contact region 34 in thebonding pad part 4 is applicable to other Embodiments.

Next, the description is given to the X-X′ section in FIG. 3. Asillustrated in FIG. 5, for example, there is a multilayer wiring layer51 (as an example, a six layer wiring of copper-based damascene wiringis assumed herein, with a tungsten via layer over the M6 wiring at theuppermost layer) at the upper surface 2 a side of the silicon singlecrystal substrate 2 (such as P-type silicon substrate) having a regiondoped with various kinds of impurities. An aluminum pad layer 30 (metalcomposite film) is composed of, for example, a barrier metal film 52 asthe lower layer, the aluminum-based metal film 53, the barrier metalfilm 54 (anti-reflection film) as the upper layer. The barrier metalfilm 52 as the lower layer is structured by, for example, a titaniumfilm (with about 10 nm of thickness, for example) as the lower layer anda titanium nitride film (with about 60 nm of thickness, for example) asthe upper layer. The aluminum-based metal film 53 as the middle layer isa metal film containing, for example, aluminum with about 1000 nm inthickness as the main component. The metal film generally containscopper and the like as the additives by several percentages. As thematerials for the barrier metal, there are used films of titanium,titanium nitride, titanium-tungsten, and a composite thereof other thanthe metals given above. Also the barrier metal film 54 as the upperlayer can be formed as laminated structure similar to the barrier metalfilm 52 as the lower layer. The aluminum pad layer 30 is overlaid withan auxiliary insulation film 55 (such as silicon oxide-based film withabout 200 nm of thickness prepared by plasma CVD) for processing. Theauxiliary insulation film 55 has an inorganic final passivation film 56(insulation surface protective film) thereon. An example of theinorganic final passivation film 56 is a laminated inorganic finalpassivation film composed of a silicon oxide-based protective film 56 a(such as a silicon oxide-based film with about 200 nm of thicknessprepared by plasma CVD) as the lower layer, a silicon nitride-basedprotective film 56 b (such as a silicon nitride-based film with about600 nm of thickness prepared by plasma CVD) as the upper layer, and thelike. The inorganic final passivation film 56 is not limited to alaminate, and a single layer film of silicon nitride-based film and thelike may be applied. Furthermore, an organic final passivation film suchas polyimide-based resin film may be further formed over the inorganicfinal passivation film 56.

As illustrated in FIG. 5, at center part of the bonding pad, there isthe bonding pad opening 27 penetrating through the inorganic finalpassivation film 56, the auxiliary insulation film 55, the barrier metalfilm 54 as the upper layer, and the like. In this state, the barriermetal film 54 as the upper layer of the bonding pad opening 27 isremoved to secure the wire bonding characteristics and the probecharacteristics. The opening part 28 thereof agrees in plane with thebonding pad opening 27. The surface of the aluminum-based metal film 53of the portion of bonding pad opening 27 is subjected to passivationtreatment (oxidation treatment), and the surface is protected by a denseand thin alumina-based film. At peripheral area of the bonding padopening 27, there is provided the titanium nitride film removing part 29(second opening part or the first titanium nitride film removing part 29a) described before. In this example, the first titanium nitride filmremoving part 29 a is covered with the inorganic final passivation film56. That is, the opening part 29 is positioned between the opening 27and the edge part of the bonding pad part 4, and is covered with theinorganic final passivation film 56.

Then, the description is given on the Y-Y′ section in FIG. 3. Asillustrated in FIG. 6, the wiring part 26 extends to Y′ side, which isdifferent from the cross section in FIG. 5.

FIG. 7 illustrates a device cross sectional flow diagram (step offorming an auxiliary insulation film) corresponding to X-X′ section inFIG. 3 in the method of manufacturing a semiconductor integrated circuitdevice of Embodiment 1 of the present application. FIG. 8 illustrates adevice cross sectional flow diagram (step of forming a resist film forpatterning a titanium nitride film removing part) corresponding to X-X′section in FIG. 3 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 1 of the present application.FIG. 9 illustrates a device cross sectional flow diagram (step offorming a titanium nitride film removing part) corresponding to X-X′section in FIG. 3 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 1 of the present application.FIG. 10 illustrates a device cross sectional flow diagram (step offorming an insulation surface protective film) corresponding to X-X′section in FIG. 3 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 1 of the present application.FIG. 11 illustrates a device cross sectional flow diagram (step offorming a pad opening) corresponding to X-X′ section in FIG. 3 in themethod of manufacturing a semiconductor integrated circuit device ofEmbodiment 1 of the present application. Based on these figures, thecore process of the method of manufacturing a semiconductor integratedcircuit device of Embodiment 1 will be described in the following.

As illustrated in FIG. 7, for example, using the front-end process andthe back-end process for a P-type silicon single crystal wafer 1 with300 mm in diameter (200 mm or 450 mm can be applied), there is prepareda wafer completing the patterning of the aluminum pad layer 30 (metalcomposite film) over the multilayer wiring layer 51. As described below,after processing the aluminum-based metal film by dry etching and thelike, normally the treatment of passivation on the surface of exposedmetal is given. Then, a silicon oxide film as the auxiliary insulationfilm 55 is formed to about 200 nm of thickness, for example, by plasmaCVD over the almost entire surface of the device surface 1 a of thewafer 1. The condition of film-forming is, for example, the gas flowrate ratio SiH₄/N₂ of about 0.5/10, the processing pressure of about 360Pascal, and the wafer stage temperature of about 400° C.

Next, as illustrated in FIG. 8, a resist film 57 is coated on the devicesurface 1 a of the wafer 1, and a resist film opening 58 is formed inthe resist film 57 to execute patterning of the titanium nitride filmremoving part 29 a by ordinary lithography.

Then, as illustrated in FIG. 9, the resist film pattern 57 is used asthe mask to execute the dry etching (that is, the vapor phase plasmaetching, same is applied to the following), thus forming an openingpenetrating through the auxiliary insulation film 55 and the barriermetal film 54 as the upper layer, or forming the first titanium nitridefilm removing part (ring-shape titanium nitride film removing part) 29 aor the second opening part (titanium nitride film removing part) 29. Thedry etching is divided into the etching of silicon oxide film and theetching of titanium nitride film. The condition of etching of siliconoxide film is, for example, the gas flow rate CF₄/CHF₃/O₂/Ar of150/30/40/650 sccm, the processing pressure of about 27 Pascal, and thewafer stage temperature of about 60° C. The condition of etching oftitanium nitride film is, for example, the gas flow rate C12/Ar of30/300 sccm, the processing pressure of about 0.7 Pascal, and the waferstage temperature of about 65° C. After the process, the resist film 57which becomes needless is removed.

Next, as illustrated in FIG. 10, almost entire surface on the devicesurface 1 a of the wafer 1 is covered with the inorganic finalpassivation film 56. As described above, when the inorganic finalpassivation film 56 is a two-layer film, the film-forming processincludes two stages: the formation of plasma CVD silicon oxide film; andthe formation of plasma CVD silicon nitride film. The condition offorming the plasma CVD silicon oxide film is, for example, the gas flowrate ratio SiH₄/N₂ of about 0.5/10, the processing pressure of about 360Pascal, and the wafer stage temperature of about 400° C. The conditionof forming the plasma CVD silicon nitride film is, for example, the gasflow rate ratio SiH₄/NH₃/N₂ of about 1.1/0.5/18, the processing pressureof about 600 Pascal, and the wafer stage temperature of about 400° C.

Next, as illustrated in FIG. 11, ordinary lithography is applied to formthe bonding pad opening 27 in the inorganic final passivation film 56.The dry etching includes two stages: the continuous dry etching of thesilicon nitride film/silicon oxide film (composite inorganic surfaceprotective film); and the etching of titanium nitride film. Thecondition of dry etching of composite inorganic surface protective filmis, for example, the gas flow rate CF₄/CHF₃/O₂/Ar of 150/30/40/650 sccm,the processing pressure of about 27 Pascal, and the wafer stagetemperature of about 60° C. The condition of dry etching of titaniumnitride film is, for example, the gas flow rate C12/Ar of 30/300 sccm,the processing pressure of about 0.7 Pascal, and the wafer stagetemperature of about 65° C.

As in the above cases of each dry etching of barrier metal film 54 asthe upper layer, after the treatment of exposing the surface of thealuminum-based metal, there is applied plasma treatment (passivationtreatment) in a gas atmosphere containing oxygen as the main componentto prevent corrosion of the aluminum-based metal film by the residualhalogen. An example of the condition of passivation treatment is, forexample, the processing pressure of about 100 Pascal in an oxygenatmosphere, the wafer temperature of about 250° C., and the treatmentperiod of about 2 min. The treatment forms a thin alumina film (aluminumoxide film) on the surface of the aluminum-based metal film 53.

After forming the bonding pad opening 27, if necessary a photosensitiveorganic final passivation film is coated on almost entire surface of thedevice surface 1 a of the wafer 1, and again a bonding pad opening partis formed by patterning. In this case, the opening part of thephotosensitive organic final passivation film is provided in theinorganic final passivation film 56, giving wider opening part than theopening part 27. Furthermore, following the ordinary semiconductorprocess, there are applied: the wafer probe inspection; the separationprocess by back grinding, dicing, and the like; the die bonding, wirebonding, and sealing of the wiring substrate 12; the package test; andthe final test. Then the product is shipped.

The above description used the auxiliary insulation film 55 as theetching support layer, as an example. The film is, however, notessential. Nevertheless, use of the film can avoid roughening of surfaceof aluminum-based metal film and other defects.

2. Description of the semiconductor integrated circuit device and themethod of manufacturing the same in Embodiment 2 of the presentapplication (mainly FIG. 12 to FIG. 15)

The characteristic of the structure peripheral to the pad according toEmbodiment 2 is to form a bonding pad opening and a slit-shape regionwhere the upper layer barrier metal layer is removed, with a space fromthe bonding pad opening, at the wiring part in the vicinity of eachbonding pad part beneath the final passivation film.

According to the example, the slit-shape titanium nitride film removingpart exists inside the wiring. However, the slit-shape part may beformed so as to cross the wiring part. When the slit-shape part crossesthe wiring part, the propagation route of abnormal oxidation of titaniumfrom the bonding pad toward the I/O circuit region can completely be cutoff. However, similar to Section 5, there is a possibility of generationof etching trench and the like in the base insulation film.

The example shows an integral slit. As described in Section 1, however,the slit may be a group of multiple shapes. Nevertheless, an integralslit increases the capacity of shutting off the propagation route ofabnormal oxidation of titanium from the bonding pad toward the I/Ocircuit region.

FIG. 12 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of thesemiconductor integrated circuit device of Embodiment 2 of the presentapplication. FIG. 13 illustrates a chip cross sectional view of X-X′section in FIG. 12. FIG. 14 illustrates a chip cross sectional view ofA-A′ section in FIG. 12. FIG. 15 illustrates a chip cross sectional viewof Y-Y′ section in FIG. 12.

The example has the characteristic of, as illustrated in FIG. 12, FIG.14, and FIG. 15, providing the second opening part (titanium nitridefilm removing part) 29 in the vicinity of the boundary 31 between thebonding pad part of the aluminum-based metal film pattern 25 and thewiring part 26, or as the second titanium nitride film removing part(slit-shape titanium nitride film removing part) 29 b in the region 32in the vicinity of boundary. Accordingly, as illustrated in FIG. 13,X-X′ section is the same as the section of ordinary bonding pad. On theother hand, regarding the Y-Y′ section and the A-A′ section, asillustrated in FIG. 14 and FIG. 15, respectively, the second titaniumnitride film removing part (slit-shape titanium nitride film removingpart) 29 b removes the barrier metal film 54 as the upper layer, and iscovered with the inorganic final passivation film 56. In this example,the slit-shape titanium nitride film removing part 29 b is provided atthe wiring part 26 side of the boundary 31. The slit-shape part 29 b maybe provided at the bonding pad part 4 side. The advantages of providingthe slit-shape titanium nitride film removing part 29 b at the wiringpart 26 side of the boundary 31 are that the area of the bonding padpart 4 is not consumed and that the growth and enlarge of titanium oxidein the portions toward the I/O circuit region 6 can be effectivelyprevented with a relatively small area. When the breadth of the wiringpart at the portion is about 40 micrometer, since the width T3 of theslit-shape titanium nitride film removing part 29 b is about 5micrometer, the breadth thereof becomes about 35 micrometer. Apreferable range of the width T3 of the slit-shape titanium nitride filmremoving part 29 b is, for example, in a range from about 0.3 to about10 micrometer.

As illustrated in FIG. 14, the embodiment adopts slit shape for thesecond titanium nitride film removing part 29 b. However, the secondpart 29 b may all be removed. That is, although a part of the secondtitanium nitride film 54 is left at the edge part of the aluminum-basedmetal film 53, all of the remained second titanium nitride film 54 maybe removed along the A-A′ section. In that case, at the edge part of thealuminum-based metal film 53, also the auxiliary insulation film 55 isremoved, and the inorganic final passivation film 56 is directly formed.With the structure, the propagation route of abnormal oxidation oftitanium from the bonding pad toward the I/O circuit region can be moresecurely cut off.

The manufacturing method is basically the same as that described inSection 1 except for the mask patterning of the opening part 27.

3. Description of the semiconductor integrated circuit device and themethod of manufacturing the same in Embodiment 3 of the presentapplication (mainly FIG. 16 and FIG. 17)

The characteristic of the structure peripheral to the pad according toEmbodiment 3 is to form both the ring-shape region (Section 1) and theslit-shape region (Section 2) beneath the final passivation film.

FIG. 16 illustrates an enlarged plan view at peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of thesemiconductor integrated circuit device of Embodiment 3 of the presentapplication. FIG. 17 illustrates a chip cross sectional view of Y-Y′section in FIG. 16.

In this example, as illustrated in FIG. 16 and FIG. 17, there are formedboth the first titanium nitride film removing part (ring-shape titaniumnitride film removing part) 29 a and the second titanium nitride filmremoving part (slit-shape titanium nitride film removing part) 29 b.Accordingly, the titanium oxide film being formed at peripheral area ofthe bonding pad opening 27 (first opening part 28) is effectivelyprevented from growing toward the I/O circuit region 6 which issensitive to that kind of abnormal part.

The dimensions and the position of the ring-shape titanium nitride filmremoving part 29 a and the second titanium nitride film removing part(slit-shape titanium nitride film removing part) 29 b are the same asthose of Section 1 or Section 2.

Regarding the slit-shape titanium nitride film removing part 29 b,similar to Embodiment 3, all the second titanium nitride film 54 and theauxiliary insulation film 55 at the edge part of the aluminum-basedmetal film 53 may be removed along the A-A′ section.

The manufacturing method is basically the same as that described inSection 1 except for the mask pattern of the opening part 27.

4. Description of the semiconductor integrated circuit device and themethod of manufacturing the same in Embodiment 4 of the presentapplication (mainly FIG. 18 to FIG. 22)

The characteristic of the structure peripheral to the pad according toEmbodiment 4 is to establish a structure for easy manufacture byremoving the final passivation film above the ring-shape region (Section1), the slit-shape region (Section 2), and the like.

FIG. 18 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of thesemiconductor integrated circuit device of Embodiment 4 of the presentapplication. FIG. 19 illustrates a chip cross sectional view of X-X′section in FIG. 18. FIG. 20 illustrates a chip cross sectional view ofY-Y′ section in FIG. 18.

As illustrated in FIG. 18, FIG. 19, and FIG. 20, the structuralcharacteristic is the absence of the inorganic insulation surfaceprotective film 56 above the first titanium nitride film removing part(ring-shape titanium nitride film removing part) 29 a. Even without theinorganic insulation surface protective film 56, the surface of thealuminum-based metal film 53 at that portion is passivation-treated, andis covered with a thin alumina film with several nanometers ofthickness, and thus the portion is not corroded under normal condition.To improve the resistance to humidity, however, it is preferable tocover the upper surface 2 a of the chip 2 with an organic finalpassivation film, as described before.

Embodiment 4 shows an example of providing only the ring-shape titaniumnitride film removing part 29 a. Adding to the ring-shape part, orinstead of the ring-shape part, the slit-shape titanium nitride filmremoving part 29 b may be provided. Furthermore, as for the slit-shapetitanium nitride film removing part 29 b, similar to Embodiment 3, allthe second titanium nitride film 54 and the auxiliary insulation film 55at the edge part of the aluminum-based metal film 53 may be removedalong the A-A′ section.

The dimensions and the position of the titanium nitride film removingpart 29, or the ring-shape titanium nitride film removing part 29 a andthe second titanium nitride film removing part (slit-shape titaniumnitride film removing part) 29 b are the same as those of Sections 1, 2or 3.

FIG. 21 illustrates a device cross sectional flow diagram (step offorming an insulation surface protective film) corresponding to X-X′section in FIG. 18 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 4 of the present application.FIG. 22 illustrates a device cross sectional flow diagram (step offorming a resist film for patterning a titanium nitride film removingpart and a pad opening) corresponding to X-X′ section in FIG. 18 in themethod of manufacturing a semiconductor integrated circuit device ofEmbodiment 4 of the present application. Regarding the manufacturingmethod, only the portion different from Section 1 is described.

The processing of FIG. 8 and FIG. 9 are skipped, and the steps proceeddirectly from FIG. 7 to FIG. 21 (corresponding to FIG. 10), forming theinorganic insulation surface protective film 56 (assuming the laminatedfilm similar to Section 1).

Then, as illustrated in FIG. 22, in the resist film 57 for forming thebonding pad opening 27, there are formed an opening 58 a for formingbonding pad opening and an opening 58 b for forming ring-shape titaniumnitride film removing part by ordinary lithography. After that, usingthe resist film 57 provided with those openings 58 a and 58 b as themask, there are formed openings 59 and 60, in relation to the brokenline portions, penetrating thorough the inorganic insulation surfaceprotective film 56 (silicon nitride film/silicon oxide film), theauxiliary insulation film 55, and the barrier metal film 54 as the upperlayer by dry etching. The dry etching process includes the step ofetching the inorganic insulation surface protective film 56 and theauxiliary insulation film 55, and the step of etching the barrier metalfilm 54 as the upper layer. The condition of dry etching of the step ofetching the inorganic insulation surface protective film 56 and theauxiliary insulation film 55 is, for example, the gas flow rateCF₄/CHF₃/O₂/Ar of 150/30/40/650 sccm, the processing pressure of about27 Pascal, and the wafer stage temperature of about 60° C. The conditionof dry etching of the step of etching the barrier metal film 54 as theupper layer is, for example, the gas flow rate C12/Ar of 30/300 sccm,the processing pressure of about 0.7 Pascal, and the wafer stagetemperature of about 65° C.

5. Description of the semiconductor integrated circuit device and themethod of manufacturing the same in Embodiment 5 of the presentapplication (mainly FIG. 23 to FIG. 30)

The example is effective for the case that the structure for preventingenlargement and growth of the titanium oxide region such as thestructure of Sections 1 to 4 is not sufficient, and the characteristicof the example is to eliminate the barrier metal film 54 as the upperlayer of entire surface of the bonding pad part 4.

FIG. 23 illustrates an enlarged plan view of peripheral area of thebonding pad part corresponding to the enlarged part R in peripheral areaof the pad, in the layout inside the chip (first main surface) of thesemiconductor integrated circuit device of Embodiment 5 of the presentapplication. FIG. 24 illustrates a chip cross sectional view of X-X′section in FIG. 23. FIG. 25 illustrates a chip cross sectional view ofY-Y′ section in FIG. 23.

As illustrated in FIG. 23, the example is similar to the ordinarybonding pad and peripheral area thereof in plane. However, thecharacteristic of the example is the existence of an etching trench 37at externally surrounding area of the bonding pad part 4. However, thetrench is generated on removing the barrier metal film 54 as the upperlayer, and the trench is not an essential element. The structuralcharacteristic of the example is that the second opening part 29 iscoupled to the first opening part 28 at entire periphery thereof.

As illustrated in FIG. 25, the wiring part 26 is overlaid with thebarrier metal film 54 as the upper layer similar to the ordinary wiringstructure, thus providing an advantage of attaining the effect bymodifying only the bonding pad part 4. Furthermore, since no complexstructure is introduced to the bonding pad part 4, the area of thebonding pad opening 27 can be effectively secured.

According to the example, the sole requirement is that the secondopening part (titanium nitride film removing part) 29 be coupled to theentire periphery of the bonding pad opening 27 of the bonding pad part4. Accordingly, it is not necessary to remove the barrier metal film 54as the upper layer in entire area of the bonding pad part 4.Nevertheless, removal of the barrier metal film 54 as the upper layer atentire area of the bonding pad part 4 is advantageous from the point ofeffective use of the pad part, and the reliability improves. The secondopening part (titanium nitride film removing part) 29 may be extended tothe wiring part 26.

FIG. 26 illustrates a device cross sectional flow diagram (step offorming an auxiliary insulation film) corresponding to X-X′ section inFIG. 23 in the method of manufacturing a semiconductor integratedcircuit device of Embodiment 5 of the present application. FIG. 27illustrates a device cross sectional flow diagram (step of forming aresist film for patterning a titanium nitride film removing part)corresponding to X-X′ section in FIG. 23 in the method of manufacturinga semiconductor integrated circuit device of Embodiment 5 of the presentapplication. FIG. 28 illustrates a device cross sectional flow diagram(step of forming a titanium nitride film removing part) corresponding toX-X′ section in FIG. 23 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 5 of the present application.FIG. 29 illustrates a device cross sectional flow diagram (step offorming an insulation surface protective film) corresponding to X-X′section in FIG. 23 in the method of manufacturing a semiconductorintegrated circuit device of Embodiment 5 of the present application.FIG. 30 illustrates a device cross sectional flow diagram (step offorming a pad opening) corresponding to X-X′ section in FIG. 23 in themethod of manufacturing a semiconductor integrated circuit device ofEmbodiment 5 of the present application. Regarding the manufacturingmethod, only the portion different from Section 1 is described.

FIG. 26 is the same as FIG. 7, and the previous processes are the sameas those in Section 1.

As illustrated in FIG. 27, there is formed the resist film 57 having theopening part 58 which has slightly wider area than that of the bondingpad part 4 by ordinary lithography.

Then, as illustrated in FIG. 28, the resist film 57 is used as the maskto remove the auxiliary insulation film 55 and the barrier metal film 54as the upper layer by the dry etching. The step forms the etching trench37 in the uppermost layer of the multilayer wiring layer 51, or in theinterlayer insulation film (silicon oxide-based insulation film) of thetungsten-via layer. The condition of dry etching of the auxiliaryinsulation film 55 is, for example, the gas flow rate CF₄/CHF₃/O₂/Ar of150/30/40/650 sccm, the processing pressure of about 27 Pascal, and thewafer stage temperature of about 60° C. The condition of dry etching ofthe step of dry etching the barrier metal film 54 as the upper layer is,for example, the gas flow rate C12/Ar of 30/300 sccm, the processingpressure of about 0.7 Pascal, and the wafer stage temperature of about65° C. After the treatment, passivation treatment is required asdescribed before.

Next, as illustrated in FIG. 29, almost entire area of the surface ofthe device surface 1 a of the wafer 1 is covered with the inorganicfinal passivation film 56. The process is the same as that in Section 1.

Then, as illustrated in FIG. 30, ordinary lithography is applied to formthe bonding pad opening 27 in the inorganic final passivation film 56.In this case, since the auxiliary insulation film 55 and the barriermetal film 54 as the upper layer beneath the bonding pad opening 27 ofthe inorganic final passivation film 56 have already been removed, thereis no need to remove them in the step. Accordingly, the process is thedry etching process only for the silicon nitride film/silicon oxide film(inorganic laminated final passivation film). The condition of dryetching of the inorganic laminated final passivation film is, forexample, the gas flow rate CF₄/CHF₃/O₂/Ar of 150/30/40/650 sccm, theprocessing pressure of about 27 Pascal, and the wafer stage temperatureof about 60° C.

6. Summary

While the invention perfected by the inventors of the presentapplication has been described in detail with reference to specificembodiments, it will be apparent that the present invention is notlimited to the embodiments and that various changes and modificationscan be made therein without departing from the spirit and scope thereof.

For example, the above embodiments give detail description of themultilayer wiring layer using a copper-based damascene wiring (buriedwiring). The present invention is not limited to that copper-baseddamascene wiring, and naturally the present invention can be applied tosilver-based or tungsten-based damascene wiring (buried wiring), oraluminum-based non-buried wiring.

1-40. (canceled)
 41. A semiconductor device comprising: a semiconductorsubstrate; a multilayer wiring layer formed over the semiconductorsubstrate; a first insulating film formed over the multilayer wiringlayer; a pad formed on the first insulating film and formed of alaminated film comprising a first metal film, a second metal film formedover the first metal film and a third metal film formed over the secondmetal film; and a second insulating film formed over the firstinsulating film and the pad, the second insulating film having a firstopening such that an upper surface of the pad is exposed from the firstopening, wherein the third metal film has a slit spaced from the firstopening in plan view.
 42. The semiconductor device according to theclaim 41, wherein the second metal film contains aluminum as a maincomponent.
 43. The semiconductor device according to the claim 41,wherein the first metal film and the second metal film contain titaniumnitride, titanium and titanium-tungsten as materials for a barriermetal.
 44. The semiconductor device according to the claim 41, whereinthe slit surrounds the first opening in plan view.
 45. The semiconductordevice according to the claim 41, wherein the slit is formed in a ringshape so as to surround the first opening in plan view.
 46. Thesemiconductor device according to the claim 41, wherein the secondinsulating film has a second opening such that an upper surface of thesecond metal film is exposed from the second opening.
 47. Thesemiconductor device according to the claim 41, wherein, in an areadefined by the first opening, the third metal film is removed and thesecond metal film is exposed.